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MCP4023T-503E/CH - Microchip

Description: MCP4023T-503E/CH, Digital Potentiometer 50kΩ 64-Position Linear Serial-2 Wire 6-Pin SOT-23

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PCB Footprints
MCP4023T-503E/CH - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - (CH,CHY) [SOT-23]
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3D Models
MCP4023T-503E/CH - Microchip  - 3D model - SOT23 (6-Pin) - (CH,CHY) [SOT-23]
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MCP4023T-503E/CH Details

  • Manufacturer Part Number:

    MCP4023T-503E/CH

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    NONVOLATILE MEMORY

  • Bandwidth-Nom:

    0.2 kHz

  • Control Interface:

    INCREMENT/DECREMENT

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.95 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Positions:

    64

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Resistance Tolerance-Max:

    20%

  • Resistor Terminal Voltage-Max:

    5 V

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    0.45 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Coefficient-Nom:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Total Resistance-Nom:

    50000 Ω

  • Width:

    1.625 mm

MCP4023T-503E/CH Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP4023T-503E/CH involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure the stability of the output voltage, it is essential to use a suitable output capacitor with a low equivalent series resistance (ESR) and a high capacitance value. A minimum output capacitance of 10uF is recommended, and the capacitor should be placed close to the device.
  • The maximum input voltage that the MCP4023T-503E/CH can handle is 6V. Exceeding this voltage may damage the device. It is recommended to use a voltage regulator or a voltage limiter to ensure that the input voltage does not exceed 6V.
  • The output voltage of the MCP4023T-503E/CH can be calculated using the following formula: Vout = (R1/R2) * (Vin - Vref) + Vref, where R1 and R2 are the resistors in the feedback network, Vin is the input voltage, and Vref is the reference voltage (typically 1.235V).
  • The power dissipation of the MCP4023T-503E/CH depends on the input voltage, output voltage, and output current. The maximum power dissipation is typically around 1.5W. It is essential to ensure that the device is properly heat-sinked to prevent overheating.

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MCP4023T-503E/CH Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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