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MCP40D17T-502E/LT - Microchip

Description: Digital Potentiometer, 5k, 7-bit, I2C

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PCB Footprints
MCP40D17T-502E/LT - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6 lead SOT (LT)
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3D Models
MCP40D17T-502E/LT - Microchip  - 3D model - SOT23 (6-Pin) - 6 lead SOT (LT)
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MCP40D17T-502E/LT Details

  • Manufacturer Part Number:

    MCP40D17T-502E/LT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SC-70, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Bandwidth-Nom:

    2 kHz

  • Control Interface:

    2-WIRE SERIAL

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Number of Functions:

    1

  • Number of Positions:

    128

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Resistance Tolerance-Max:

    20%

  • Resistor Terminal Voltage-Max:

    5.5 V

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Coefficient-Nom:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Total Resistance-Nom:

    5000 Ω

  • Width:

    1.25 mm

MCP40D17T-502E/LT Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP40D17T-502E/LT involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and the GND pin to a solid ground plane. The device also requires a bypass capacitor (typically 10uF) between VCC and GND, placed close to the device. Additionally, ensure that the input signals are within the recommended voltage range.
  • The maximum power dissipation of the MCP40D17T-502E/LT is 1.4W. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum power for extended periods. Also, ensure that the PCB is designed to dissipate heat efficiently.
  • To troubleshoot issues with the MCP40D17T-502E/LT, start by verifying the power supply and input signals. Check for proper biasing, and ensure that the input signals are within the recommended voltage range. Use an oscilloscope to monitor the output and input signals, and check for any signs of oscillation or noise. If issues persist, consult the datasheet and application notes for guidance.
  • The MCP40D17T-502E/LT is a commercial-grade device, and its use in high-reliability or safety-critical applications may require additional testing and validation. Consult the datasheet and application notes for guidance, and consider using a device with a higher reliability rating if necessary.

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MCP40D17T-502E/LT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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