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MCP40D18T-104E/LT - Microchip

Description: MCP40D18T-104E/LT, Digital Potentiometer 100kΩ 128-Position Linear Serial-I2C 6-Pin SC-70

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MCP40D18T-104E/LT - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 6-Pin SC-70-ren1
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MCP40D18T-104E/LT - Microchip  - 3D model - Small Outline Packages - 6-Pin SC-70-ren1
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MCP40D18T-104E/LT Details

  • Manufacturer Part Number:

    MCP40D18T-104E/LT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SC-70, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Bandwidth-Nom:

    0.1 kHz

  • Control Interface:

    2-WIRE SERIAL

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Number of Functions:

    1

  • Number of Positions:

    128

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Resistance Tolerance-Max:

    20%

  • Resistor Terminal Voltage-Max:

    5.5 V

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Coefficient-Nom:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Total Resistance-Nom:

    100000 Ω

  • Width:

    1.25 mm

MCP40D18T-104E/LT Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP40D18T-104E/LT involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The MCP40D18T-104E/LT requires a single 3.3V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the power supply has stabilized, and to ensure that the power supply is within the recommended operating range.
  • The maximum operating frequency of the MCP40D18T-104E/LT is 40 MHz. Operating the device at higher frequencies can lead to increased power consumption, reduced accuracy, and potential device damage. It's recommended to operate the device within the specified frequency range to ensure optimal performance.
  • The MCP40D18T-104E/LT has a maximum junction temperature of 150°C. To handle thermal management, it's recommended to use a heat sink, ensure good airflow, and avoid blocking the airflow around the device. Additionally, it's recommended to keep the device within the specified operating temperature range to ensure optimal performance.
  • The MCP40D18T-104E/LT has built-in ESD protection, but it's still recommended to take precautions to prevent ESD events. This includes using ESD-safe handling and storage procedures, using ESD-protective packaging, and ensuring that the device is properly grounded during handling and assembly.

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MCP40D18T-104E/LT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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