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MCP4141-104E/MS - Microchip

Description: Digital Potentiometer ICs Digital Pot 128 step SPI Sngl Ch

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MCP4141-104E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD PLASTIC SMALL OUTLINE PACKAGE (MS)
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MCP4141-104E/MS - Microchip - 3D model - Small Outline Packages - 8-LEAD PLASTIC SMALL OUTLINE PACKAGE (MS)
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MCP4141-104E/MS Details

  • Manufacturer Part Number:

    MCP4141-104E/MS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Bandwidth-Nom:

    0.1 kHz

  • Control Interface:

    INCREMENT/DECREMENT

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Positions:

    129

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Resistance Tolerance-Max:

    20%

  • Resistor Terminal Voltage-Max:

    5 V

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Coefficient-Nom:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Total Resistance-Nom:

    100000 Ω

  • Width:

    3 mm

MCP4141-104E/MS Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding topology, keeping the digital and analog grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the resistive digital potentiometer's (RDP) input and output traces short and away from high-frequency signals.
  • The device is rated for operation between -40°C and +125°C. Ensure proper thermal management by providing adequate heat sinking, avoiding high-power dissipation, and keeping the device away from heat sources. Also, follow the recommended PCB layout and thermal design guidelines.
  • Power up the VDD supply before the VSS supply. Ensure that VDD reaches its minimum specified voltage (2.7V) before applying any digital signals. Also, ensure that the CS pin is high during power-up to prevent unwanted writes to the device.
  • To enter power-down mode, set the CS pin low and ensure that the SCK and SI pins are low. In power-down mode, the device consumes minimal power, but the wiper position is not guaranteed. When exiting power-down mode, ensure that the CS pin is high before accessing the device.
  • The maximum capacitance that can be connected to the output is 100nF. Exceeding this value may cause instability or oscillations in the device. If a larger capacitance is required, consider adding a series resistor to limit the capacitive load.

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MCP4141-104E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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