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MCP4351-103E/ST - Microchip

Description: MCP4351-103E/ST, Digital Potentiometer 12kΩ 257-Position Linear 4-channel SPI 20-Pin TSSOP

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PCB Footprints
MCP4351-103E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (ST)20-Lead(TSSOP)
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3D Models
MCP4351-103E/ST - Microchip  - 3D model - Small Outline Packages - (ST)20-Lead(TSSOP)
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MCP4351-103E/ST Details

  • Manufacturer Part Number:

    MCP4351-103E/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM, LEAD FREE, PLASTIC, TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    TSSOP-20

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    1 Week

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Bandwidth-Nom:

    1 kHz

  • Control Interface:

    3-WIRE SERIAL

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Positions:

    257

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Resistance Tolerance-Max:

    20%

  • Resistor Terminal Voltage-Max:

    5.5 V

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.45 mA

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Coefficient-Nom:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Total Resistance-Nom:

    10000 Ω

  • Width:

    4.4 mm

MCP4351-103E/ST Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding scheme, using a solid ground plane, and keeping analog and digital signals separate to minimize noise. Additionally, use short and direct traces for the VREF and VOUT pins to reduce noise and ensure stability.
  • To ensure proper calibration, follow the recommended calibration procedure outlined in the datasheet, which involves setting the wiper to the midpoint and then adjusting the voltage output to the desired value. It's also important to use a high-precision voltage reference and to minimize noise and interference during calibration.
  • To prevent damage or malfunction, Microchip recommends powering up the VDD pin before the VREF pin, and ensuring that the VREF pin is stable before applying a voltage to the VOUT pin. Additionally, ensure that the voltage on the VOUT pin does not exceed the maximum rating during power-up.
  • To handle thermal considerations, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and follow proper thermal design guidelines. Additionally, consider using a thermally-enhanced package or a device with a higher power rating if high-power applications are expected.
  • To prevent ESD damage, follow proper ESD handling and assembly procedures, use ESD-protective packaging and materials, and consider adding external ESD protection devices such as TVS diodes or ESD arrays. Additionally, ensure that the PCB design includes ESD protection features such as guard rings and ESD-protected I/Os.

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MCP4351-103E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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