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MCP4461-104E/ST - Microchip

Description: Digital Potentiometer ICs 100k I2C Quad Ch 8bt Nonvolatile Memory

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MCP4461-104E/ST - Microchip - PCB symbol
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PCB Footprints
MCP4461-104E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (ST)20-Lead(TSSOP)
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3D Models
MCP4461-104E/ST - Microchip - 3D model - Small Outline Packages - (ST)20-Lead(TSSOP)
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MCP4461-104E/ST Details

  • Manufacturer Part Number:

    MCP4461-104E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Manufacturer Package Code:

    TSSOP-20

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    NON VOLATILE MEMORY

  • Bandwidth-Nom:

    0.1 kHz

  • Control Interface:

    2-WIRE SERIAL

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Positions:

    257

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR/LOGARITHMIC

  • Resistance Tolerance-Max:

    20%

  • Resistor Terminal Voltage-Max:

    5.5 V

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Coefficient-Nom:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Total Resistance-Nom:

    100000 Ω

  • Width:

    4.4 mm

MCP4461-104E/ST Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding scheme, using a solid ground plane, and keeping analog and digital signals separate to minimize noise. Additionally, use short and direct traces for the VREF and VOUT pins to reduce noise and ensure accurate output.
  • Calibration involves applying a known input voltage and adjusting the wiper position to achieve the desired output voltage. Use a high-precision voltage source and a multimeter to measure the output voltage. Adjust the wiper position until the desired output voltage is achieved.
  • Power up the VDD pin first, followed by the VREF pin. Ensure that the VREF pin is powered up before applying any input voltage to the VIN pin. This sequence helps prevent damage and ensures correct operation.
  • Ensure good thermal conductivity by using a heat sink or a thermally conductive PCB material. Keep the device away from heat sources and ensure good airflow. Monitor the junction temperature (TJ) and adjust the power dissipation accordingly to prevent overheating.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Store the device in an anti-static bag or tube when not in use.

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MCP4461-104E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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