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MCP4631-502E/ST - Microchip

Description: Digital Potentiometer ICs Dual 7B V I2C POT

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MCP4631-502E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (ST)14-Lead(TSSOP)
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MCP4631-502E/ST - Microchip  - 3D model - Small Outline Packages - (ST)14-Lead(TSSOP)
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MCP4631-502E/ST Details

  • Manufacturer Part Number:

    MCP4631-502E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    PLASTIC, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    THE RESISTOR ARRAY VALUES ARE 5000 OHM,10000 OHM, 50000 OHM

  • Bandwidth-Nom:

    2 kHz

  • Control Interface:

    2-WIRE SERIAL

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Positions:

    257

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Resistance Tolerance-Max:

    20%

  • Resistor Terminal Voltage-Max:

    5.5 V

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Coefficient-Nom:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Total Resistance-Nom:

    100000 Ω

  • Width:

    4.4 mm

MCP4631-502E/ST Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VDD first, followed by VSS, and then the logic inputs. This ensures that the device powers up correctly and minimizes the risk of latch-up or damage.
  • To ensure accurate voltage output, it's essential to use a high-precision voltage reference, such as the internal reference or an external reference with low temperature coefficient. Additionally, ensure that the output voltage is buffered with an op-amp or a buffer amplifier to minimize load regulation effects.
  • The maximum capacitive load that the MCP4631 can drive is 1000 pF. Exceeding this limit may cause instability or oscillations in the output voltage. If a larger capacitive load is required, consider adding an external buffer or op-amp to improve the drive capability.
  • To implement a soft-start function, connect a capacitor between the VOUT pin and the VSS pin. The capacitor will slow down the output voltage rise time, allowing for a soft-start. The value of the capacitor depends on the desired rise time and the output voltage.
  • The EN (Enable) pin is used to enable or disable the output voltage. When the EN pin is high, the output voltage is enabled. When the EN pin is low, the output voltage is disabled, and the device enters a low-power shutdown mode. Use the EN pin to control the output voltage in applications that require power sequencing or shutdown.

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MCP4631-502E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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