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MCP4661-104E/ST - Microchip

Description: Digital Potentiometer 256 Step 100kOhm

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MCP4661-104E/ST - Microchip - PCB symbol
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PCB Footprints
MCP4661-104E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (ST)14-Lead(TSSOP)
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MCP4661-104E/ST - Microchip - 3D model - Small Outline Packages - (ST)14-Lead(TSSOP)
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MCP4661-104E/ST Details

  • Manufacturer Part Number:

    MCP4661-104E/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM, PLASTIC, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Philippines, Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    NON-VOLATILE MEMORY

  • Bandwidth-Nom:

    0.1 kHz

  • Control Interface:

    INCREMENT/DECREMENT

  • Converter Type:

    DIGITAL POTENTIOMETER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Positions:

    257

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Resistance Law:

    LINEAR

  • Resistance Tolerance-Max:

    20%

  • Resistor Terminal Voltage-Max:

    5.5 V

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Coefficient-Nom:

    150 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Total Resistance-Nom:

    100000 Ω

  • Width:

    4.4 mm

MCP4661-104E/ST Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP4661-104E/ST involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the device's internal voltage reference. Additionally, consider using an external voltage reference for improved accuracy.
  • The MCP4661-104E/ST operates over a temperature range of -40°C to +125°C. As the temperature increases, the device's performance may degrade, resulting in reduced accuracy and increased noise. Ensure proper thermal management and consider using thermal protection devices to prevent overheating.
  • To protect the MCP4661-104E/ST from EMI and RFI, use shielding, filtering, and grounding techniques. Ensure the device is placed in a shielded enclosure, and use filters on the input and output lines. Additionally, use a common-mode choke to reduce electromagnetic radiation.
  • The recommended power-up sequence for the MCP4661-104E/ST involves applying the analog power supply (VDD) before the digital power supply (VCC). Ensure that the analog power supply is stable before applying the digital power supply.

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MCP4661-104E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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