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MCP47FEB28-20E/ST - Microchip

Description: OCTAL CHANNEL, 12-BIT, EEPROM, I

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MCP47FEB28-20E/ST - Microchip - PCB symbol
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PCB Footprints
MCP47FEB28-20E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead Plastic Thin Shrink Small Outline (ST) - 4.4mm body [TSSOP]
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3D Models
MCP47FEB28-20E/ST - Microchip - 3D model - Small Outline Packages - 20-Lead Plastic Thin Shrink Small Outline (ST) - 4.4mm body [TSSOP]
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MCP47FEB28-20E/ST Details

  • Manufacturer Part Number:

    MCP47FEB28-20E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    TSSOP-20

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2020-06-22

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.146484375%

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Settling Time-Nom (tstl):

    7.8 µs

  • Supply Current-Max:

    3 mA

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

MCP47FEB28-20E/ST Frequently Asked Questions (FAQs)

  • Microchip provides a layout and routing guide in their application note AN263, which recommends using a 4-layer PCB with a solid ground plane, placing the device close to the analog power supply, and using short, direct traces for the analog signals.
  • The MCP47FEB28-20E/ST has an internal calibration mechanism that can be accessed through the SPI interface. Refer to the datasheet section 5.4 for the calibration procedure, which involves writing specific values to the calibration registers.
  • The maximum output current of the MCP47FEB28-20E/ST is 20mA. Exceeding this current limit can cause the output voltage to droop, affecting accuracy. To maintain accuracy, ensure that the output current is within the specified limit and use an external buffer amplifier if necessary.
  • The POR and BOR features are enabled by default. To handle them, ensure that the power supply ramps up slowly (typically 1ms to 10ms) to allow the device to reset properly. Also, use an external capacitor to filter the power supply and prevent false resets.
  • The recommended operating temperature range for the MCP47FEB28-20E/ST is -40°C to +125°C. Operating outside this range can affect the device's accuracy, linearity, and output voltage stability. Ensure that the device is operated within the specified temperature range for optimal performance.

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MCP47FEB28-20E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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