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MCP48FEB22-E/UN - Microchip

Description: Microchip MCP48FEB22-E/UN, 2-channel 12 bit DAC, 10-Pin MSOP

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PCB Footprints
MCP48FEB22-E/UN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10-Lead Plastic Micro Small Outline Package (MS) [MSOP]
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3D Models
MCP48FEB22-E/UN - Microchip  - 3D model - Small Outline Packages - 10-Lead Plastic Micro Small Outline Package (MS) [MSOP]
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MCP48FEB22-E/UN Details

  • Manufacturer Part Number:

    MCP48FEB22-E/UN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog Output Voltage-Max:

    5.46 V

  • Analog Output Voltage-Min:

    0.01 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.1465%

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    7.8 µs

  • Supply Current-Max:

    1.9 mA

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP48FEB22-E/UN Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VDD first, followed by VREF, and then the analog input signal. This ensures proper device operation and prevents potential latch-up conditions.
  • To minimize noise and ensure reliable operation, it is recommended to follow proper PCB layout practices, such as separating analog and digital grounds, using a solid ground plane, and keeping sensitive analog signals away from digital signals. Additionally, decoupling capacitors should be placed close to the device's power pins.
  • The MCP48FEB22-E/UN can drive capacitive loads up to 100 pF. Exceeding this limit may affect the device's stability and performance.
  • To handle thermal considerations, ensure good airflow around the device, and avoid blocking the airflow with components or obstacles. Additionally, consider using a heat sink or thermal pad to dissipate heat, especially in high-power or high-temperature applications.
  • The recommended clock frequency range for the MCP48FEB22-E/UN is 1 MHz to 50 MHz. Operating the device outside of this range may affect its performance and accuracy.

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MCP48FEB22-E/UN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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