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MCP6001UT-E/OTVAO - Microchip

Description: Operational Amplifiers - Op Amps Automotive, Single 1.8V 1MHz OP, E temp

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PCB Footprints
MCP6001UT-E/OTVAO - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT-23+
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3D Models
MCP6001UT-E/OTVAO - Microchip  - 3D model - SOT23 (5-Pin) - SOT-23+
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MCP6001UT-E/OTVAO Details

  • Manufacturer Part Number:

    MCP6001UT-E/OTVAO

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    0.17 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    25118.86

  • Wideband:

    NO

  • Width:

    1.55 mm

MCP6001UT-E/OTVAO Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6001UT-E/OTVAO is 670 mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the MCP6001UT-E/OTVAO is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not be exceeded.
  • To minimize noise and ensure optimal performance, follow good PCB layout practices such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, consider using a low-noise power supply and minimizing the distance between the op-amp and the feedback resistors.
  • While the MCP6001UT-E/OTVAO is an op-amp, it can be used as a comparator in some applications. However, it's not recommended as the device is not optimized for comparator operation and may not provide the same level of performance as a dedicated comparator. If comparator functionality is required, consider using a dedicated comparator device.
  • The recommended decoupling capacitor value for the MCP6001UT-E/OTVAO is 0.1 μF to 1 μF, depending on the specific application and noise requirements. A higher-value capacitor may be required for high-frequency applications or in noisy environments.

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MCP6001UT-E/OTVAO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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