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MCP6002-I/SN - Microchip

Description: 1MHz Low Power Dual Op Amplifier Microchip MCP6002-I/SN Dual Operational Amplifier, 1MHz CMOS, Rail-Rail, 3 V, 5 V, 8-Pin SOIC

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MCP6002-I/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD PLASTIC SMALL OUTLINE (SN)-ren1
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MCP6002-I/SN Details

  • Manufacturer Part Number:

    MCP6002-I/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    1 Week

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    0.34 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    25110

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6002-I/SN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6002 is 670 mW, which is calculated based on the maximum junction temperature (150°C) and the thermal resistance (125°C/W) of the package.
  • To ensure stability, make sure to use a gain resistor (Rg) that is less than or equal to 1 kΩ, and a feedback capacitor (Cf) that is less than or equal to 22 pF. Additionally, use a low-ESR capacitor (e.g., ceramic or film capacitor) for the bypass capacitor (Cb) to minimize noise and oscillations.
  • To minimize noise and ensure proper operation, keep the input and output traces short and away from each other, and use a ground plane to reduce electromagnetic interference (EMI). Also, place the bypass capacitor (Cb) as close as possible to the VDD pin, and use a low-impedance path to the power supply.
  • While the MCP6002 can be used as a comparator, it is not recommended due to its relatively slow slew rate (0.6 V/μs) and limited bandwidth (1 MHz). For comparator applications, consider using a dedicated comparator IC, such as the MCP654 or MCP655.
  • To protect the MCP6002 from electrostatic discharge (ESD), use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage.

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MCP6002-I/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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