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MCP604-E/P - Microchip

Description: Microchip MCP604-E/P, Quad Op Amp, 2.8MHz Rail-Rail, 2.7 → 6 V, 14-Pin PDIP

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MCP604-E/P - Microchip - PCB symbol
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PCB Footprints
MCP604-E/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
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MCP604-E/P - Microchip - 3D model - Dual-In-Line Packages - 14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
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MCP604-E/P Details

  • Manufacturer Part Number:

    MCP604-E/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    14

  • Manufacturer Package Code:

    PDIP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDIP-T14

  • JESD-609 Code:

    e3

  • Length:

    19.05 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4.32 mm

  • Slew Rate-Nom:

    2.3 V/us

  • Supply Current-Max:

    1.296 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2800

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    7.62 mm

MCP604-E/P Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP604-E/P is dependent on the package type and ambient temperature. For the PDIP package, it is 670 mW at 25°C, and for the SOIC package, it is 500 mW at 25°C. However, it is recommended to derate the power dissipation by 6.7 mW/°C for temperatures above 25°C.
  • To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10-100 nF) between the output and the inverting input pins. This capacitor helps to compensate for the internal pole of the op-amp and prevents oscillations.
  • To minimize noise and EMI, it is recommended to follow good PCB layout practices, such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the op-amp. Additionally, it is recommended to use a low-impedance power supply and to avoid running high-frequency signals near the op-amp.
  • While the MCP604-E/P can be used as a comparator, it is not recommended due to its relatively slow slew rate and limited bandwidth. Microchip offers dedicated comparator products, such as the MCP654, that are better suited for comparator applications.
  • The input bias current of the MCP604-E/P is typically specified as a maximum value in the datasheet. However, the actual input bias current can be calculated using the equation: IB = (VCC - VEE) / (2 * RIN), where RIN is the input resistance and VCC and VEE are the supply voltages.

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MCP604-E/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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