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MCP604-E/SL - Microchip

Description: Microchip MCP604-E/SL, Quad Op Amp, 2.8MHz Rail-Rail, 2.7 → 6 V, 14-Pin SOIC

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MCP604-E/SL - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14 Lead Small Outline (SL) Narrow SOIC
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MCP604-E/SL - Microchip  - 3D model - Small Outline Packages - 14 Lead Small Outline (SL) Narrow SOIC
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MCP604-E/SL Details

  • Manufacturer Part Number:

    MCP604-E/SL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOIC-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.69 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    2.3 V/us

  • Supply Current-Max:

    1.296 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    2800

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP604-E/SL Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP604-E/SL is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-100 nF) between the output and the inverting input to compensate for the op-amp's internal capacitance and ensure phase margin.
  • To minimize noise and oscillations, it's recommended to keep the input and output traces short and away from each other, use a ground plane, and decouple the power supply with a 10-100 nF capacitor. Additionally, avoid routing high-frequency signals near the op-amp's inputs.
  • While the MCP604-E/SL can be used as a comparator, it's not recommended due to its relatively slow slew rate (0.5 V/μs) and limited bandwidth (1.4 MHz). A dedicated comparator IC would be a better choice for most applications.
  • The MCP604-E/SL has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device, such as using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.

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MCP604-E/SL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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