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MCP604-E/ST - Microchip

Description: Microchip MCP604-E/ST, Quad Op Amp, 2.8MHz Rail-Rail, 2.7 → 6 V, 14-Pin TSSOP

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PCB Footprints
MCP604-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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3D Models
MCP604-E/ST - Microchip  - 3D model - Small Outline Packages - 14-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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MCP604-E/ST Details

  • Manufacturer Part Number:

    MCP604-E/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2.3 V/us

  • Supply Current-Max:

    1.296 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    2800

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP604-E/ST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP604-E/ST is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability, add a capacitor (typically 10-100 pF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • Use a star-ground configuration, keep the input and output traces short and away from each other, and use a ground plane to minimize noise and EMI. Also, avoid routing high-frequency signals near the op-amp's inputs.
  • Yes, the MCP604-E/ST can be used as a comparator, but it's essential to ensure the input common-mode voltage is within the specified range, and to add hysteresis to prevent oscillations. Also, consider the op-amp's slew rate and propagation delay when designing the comparator circuit.
  • Use a high-impedance input source, and consider adding a voltage follower or a buffer stage to minimize the input bias current's effect. For offset voltage, use a trimming circuit or a calibration technique to compensate for the error.

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MCP604-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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