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MCP604T-E/SL - Microchip

Description: Operational Amplifiers - Op Amps Quad 2.7V

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MCP604T-E/SL Details

  • Manufacturer Part Number:

    MCP604T-E/SL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOIC-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.69 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    2.3 V/us

  • Supply Current-Max:

    1.296 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    2800

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP604T-E/SL Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP604T-E/SL is 670 mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-100 nF) between the output and the inverting input to compensate for the internal pole. This is because the MCP604T-E/SL has a high gain-bandwidth product, which can cause oscillations if not properly compensated.
  • To minimize noise and EMI, it's recommended to follow good layout and routing practices, such as keeping the input and output traces short and away from each other, using a solid ground plane, and avoiding vias and right-angle turns in the signal traces. Additionally, decoupling capacitors should be placed close to the op-amp's power pins to reduce noise and ripple.
  • The MCP604T-E/SL is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's recommended to derate the op-amp's specifications according to the temperature derating curves provided in the datasheet. Additionally, the user should ensure that the device is properly heatsinked and that the maximum junction temperature is not exceeded.
  • The choice of resistors and capacitors for the feedback network depends on the specific application and the desired frequency response. In general, it's recommended to use low-noise, high-precision resistors and capacitors with low equivalent series resistance (ESR) and high-quality dielectrics. The datasheet provides guidelines for selecting the feedback components, and simulation tools such as SPICE can be used to optimize the design.

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MCP604T-E/SL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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