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MCP6051-E/SN - Microchip

Description: Single 1.8V 300kHz Op Amp, E temp

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MCP6051-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
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3D Models
MCP6051-E/SN - Microchip  - 3D model - Small Outline Packages - 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
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MCP6051-E/SN Details

  • Manufacturer Part Number:

    MCP6051-E/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, LEAD FREE, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.15 V/us

  • Supply Current-Max:

    0.045 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    385

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6051-E/SN Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MCP6051-E/SN involves keeping the analog and digital grounds separate, using a star-ground configuration, and placing the device close to the analog signal sources to minimize noise.
  • To optimize the performance of the MCP6051-E/SN in noisy environments, use a low-pass filter on the analog input, add a capacitor between the VDD and VSS pins, and use a shielded cable for the analog input signal.
  • The maximum clock frequency that the MCP6051-E/SN can handle is 5 MHz, but it's recommended to use a clock frequency of 1-2 MHz for optimal performance.
  • To calibrate the MCP6051-E/SN, apply a known input voltage, measure the output code, and adjust the gain and offset registers accordingly. Repeat this process for multiple input voltages to ensure optimal performance.
  • The MCP6051-E/SN has a power-on reset (POR) circuit that resets the device to its default state when the power supply voltage rises above 1.5V. The POR circuit ensures that the device starts up in a known state.

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MCP6051-E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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