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MCP606-I/SN - Microchip

Description: Single 25uA,2.5V Op Amp,MCP606-I/SN

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MCP606-I/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
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3D Models
MCP606-I/SN - Microchip  - 3D model - Small Outline Packages - 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
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MCP606-I/SN Details

  • Manufacturer Part Number:

    MCP606-I/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00008 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    250 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.08 V/us

  • Supply Current-Max:

    0.025 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    155

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP606-I/SN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP606-I/SN is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability in a unity-gain buffer configuration, add a capacitor (typically 10-100 pF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • To minimize noise and EMI, use a star-ground configuration, keep the input and output traces short and separate, and avoid running digital and analog traces parallel to each other. Also, use a ground plane and decouple the power supply with capacitors.
  • Yes, the MCP606-I/SN can be used as a comparator. To do so, connect the inverting input to the reference voltage, and the non-inverting input to the signal to be compared. Use a pull-up resistor on the output to define the output voltage levels.
  • The slew rate of the MCP606-I/SN is approximately 0.5 V/μs. To calculate the slew rate, use the formula: Slew Rate = ΔV / Δt, where ΔV is the output voltage change and Δt is the time it takes to change. A higher slew rate is required for high-frequency applications.

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MCP606-I/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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