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MCP6064T-E/ST - Microchip

Description: Features • Low Offset Voltage: ±150 µV (maximum) • Low Quiescent Current: 60 µA (typical) • Rail-to-Rail Input and Output • Wide Supply Voltage Range: 1.8V to 6.0V • Gain Bandwidth Product: 730 kHz (typical) • Unity Gain Stable • Extended Temperature Range: -40°C to +125°C • No Phase Reversal

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MCP6064T-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead Plastic Thin Shrink Small Outline (ST)--0
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MCP6064T-E/ST Details

  • Manufacturer Part Number:

    MCP6064T-E/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM, PLASTIC, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    0.25 V/us

  • Supply Current-Max:

    0.36 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    730

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP6064T-E/ST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6064T-E/ST is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100 pF) between the output and the inverting input to compensate for the op-amp's internal capacitance.
  • To minimize noise and EMI, it's recommended to use a star-ground configuration, keep the input and output traces short and away from each other, and use a ground plane to shield the op-amp from external noise sources.
  • The MCP6064T-E/ST is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. It's recommended to derate the power dissipation and ensure proper heat sinking to prevent overheating.
  • The input bias current and input offset voltage can be minimized by using a high-impedance input source, using a voltage follower configuration, and adjusting the input voltage to compensate for the input offset voltage.

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MCP6064T-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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