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MCP6072T-E/SN - Microchip

Description: Low Offset Voltage: ±150 µV (maximum) Low Quiescent Current: 110 µA (typical) Rail-to-Rail Input and Output Wide Supply Voltage Range: 1.8V to 6.0V Gain Bandwidth Product: 1.2 MHz (typical) Unity Gain Stable

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PCB Footprints
MCP6072T-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
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3D Models
MCP6072T-E/SN - Microchip  - 3D model - Small Outline Packages - 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
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MCP6072T-E/SN Details

  • Manufacturer Part Number:

    MCP6072T-E/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.34 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6072T-E/SN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6072T-E/SN is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet.
  • The recommended input impedance for the MCP6072T-E/SN is greater than 1 kΩ to ensure optimal performance and minimize input bias current effects.
  • Yes, the MCP6072T-E/SN can be used in a single-supply configuration, but it's essential to ensure that the input common-mode voltage is within the specified range to maintain optimal performance.
  • To handle ESD protection, it's recommended to use a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection device in conjunction with proper PCB layout practices to minimize the risk of ESD damage.

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MCP6072T-E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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