MCP608-I/ST - Microchip

MCP608-I/ST Details

• Manufacturer Part Number:

  MCP608-I/ST

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  SOIC

• Package Description:

  4.40 MM, PLASTIC, TSSOP-8

• Pin Count:

  8

• Manufacturer Package Code:

  TSSOP-8

• Country Of Origin:

  Malaysia, Philippines, Thailand

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Factory Lead Time:

  6 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  8

• Amplifier Type:

  OPERATIONAL AMPLIFIER

• Architecture:

  VOLTAGE-FEEDBACK

• Average Bias Current-Max (IIB):

  0.00008 µA

• Common-mode Reject Ratio-Min:

  75 dB

• Common-mode Reject Ratio-Nom:

  91 dB

• Frequency Compensation:

  YES

• Input Offset Voltage-Max:

  250 µV

• JESD-30 Code:

  R-PDSO-G8

• JESD-609 Code:

  e3

• Length:

  4.4 mm

• Low-Bias:

  YES

• Low-Offset:

  YES

• Micropower:

  YES

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP8,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Packing Method:

  TUBE

• Peak Reflow Temperature (Cel):

  260

• Power:

  NO

• Programmable Power:

  NO

• Qualification Status:

  Not Qualified

• Screening Level:

  TS 16949

• Seated Height-Max:

  1.2 mm

• Slew Rate-Nom:

  0.08 V/us

• Supply Current-Max:

  0.025 mA

• Supply Voltage Limit-Max:

  7 V

• Supply Voltage-Nom (Vsup):

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Unity Gain BW-Nom:

  155

• Voltage Gain-Min:

  100000

• Wideband:

  NO

• Width:

  3 mm