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MCP609T-I/SL - Microchip

Description: Operational Amplifiers - Op Amps Quad 25 uA 2.5V

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MCP609T-I/SL - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14-LEAD PSO (SL) - NARROW
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MCP609T-I/SL - Microchip  - 3D model - Small Outline Packages - 14-LEAD PSO (SL) - NARROW
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MCP609T-I/SL Details

  • Manufacturer Part Number:

    MCP609T-I/SL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOIC-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00008 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    250 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.08 V/us

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    155

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP609T-I/SL Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP609T-I/SL is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, consider using a phase margin analyzer tool to verify stability.
  • For optimal performance, keep the input and output traces short and symmetrical, and avoid running digital signals near the op-amp. Use a solid ground plane, and consider using a guard ring around the op-amp to reduce noise and interference.
  • The MCP609T-I/SL is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate in high-temperature environments, consider using a thermally enhanced package or a different op-amp specifically designed for high-temperature applications.
  • Follow proper ESD handling procedures when handling the MCP609T-I/SL, and consider adding external ESD protection devices (e.g., TVS diodes) to protect the op-amp from electrostatic discharge.

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MCP609T-I/SL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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