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MCP6141-E/SNVAO - Microchip

Description: Operational Amplifiers - Op Amps Single 1.6V 100 kHz OP, E temp

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MCP6141-E/SNVAO Details

  • Manufacturer Part Number:

    MCP6141-E/SNVAO

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    62 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    24 V/us

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    56234

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6141-E/SNVAO Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6141-E/SNVAO is 670 mW, which is calculated based on the maximum junction temperature (150°C) and the thermal resistance from junction to ambient (125°C/W).
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-22 pF) between the output and the inverting input pins to compensate for the internal pole. This is because the MCP6141-E/SNVAO has a high gain-bandwidth product, which can cause oscillations without proper compensation.
  • To minimize noise and EMI, it's recommended to follow good PCB layout practices, such as keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the power pins. Additionally, avoid routing high-frequency signals near the op-amp's inputs and outputs.
  • The MCP6141-E/SNVAO is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate the device in a high-temperature environment, ensure that you follow proper thermal management practices, such as providing adequate heat sinking and airflow.
  • Choose bypass capacitors with a low equivalent series resistance (ESR) and a high self-resonant frequency to ensure that they can effectively filter out high-frequency noise. A 0.1-10 μF ceramic capacitor is a good starting point, but the optimal value may vary depending on the specific application and PCB layout.

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MCP6141-E/SNVAO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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