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MCP6141-I/MS - Microchip

Description: Operational Amplifiers - Op Amps G>10 Sgl 1.6V 100kHz

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PCB Footprints
MCP6141-I/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead MS MSOP
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MCP6141-I/MS - Microchip  - 3D model - Small Outline Packages - 8 Lead MS MSOP
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MCP6141-I/MS Details

  • Manufacturer Part Number:

    MCP6141-I/MS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    62 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    24000 V/us

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3 mm

MCP6141-I/MS Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6141-I/MS is dependent on the package type and thermal resistance. For the MSOP package, the maximum power dissipation is approximately 450 mW at 25°C ambient temperature.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100 nF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • To minimize noise and EMI, it's recommended to follow good PCB layout practices, such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the op-amp's power pins.
  • While the MCP6141-I/MS can be used as a comparator, it's not recommended due to its relatively slow slew rate and limited bandwidth. Microchip offers dedicated comparator products, such as the MCP6541, that are better suited for comparator applications.
  • The input bias current of the MCP6141-I/MS is typically in the range of 1-10 pA. To calculate its impact on your circuit, you can use the input bias current specification and the input impedance of your circuit to determine the resulting voltage offset.

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MCP6141-I/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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