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MCP6143-I/SN - Microchip

Description: G>10 1.6V 100KHz OpAmp CS,MCP6143-I/SN

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MCP6143-I/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead(SN) SOIC
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MCP6143-I/SN - Microchip  - 3D model - Small Outline Packages - 8-Lead(SN) SOIC
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MCP6143-I/SN Details

  • Manufacturer Part Number:

    MCP6143-I/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    62 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    24000 V/us

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6143-I/SN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6143 is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 720mW at 25°C. For the MSOP package, it is 560mW at 25°C.
  • To minimize noise and ensure optimal performance, it is recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping signal traces short and direct. Additionally, place decoupling capacitors close to the op-amp power pins and use a low-ESR capacitor for the bypass capacitor.
  • The recommended capacitor value for the bypass capacitor is 0.1uF to 1uF, with a low-ESR ceramic capacitor being a good choice. The exact value depends on the specific application and noise requirements.
  • While the MCP6143 is an op-amp, it can be used as a comparator in some applications. However, it is not optimized for comparator operation and may not provide the same level of performance as a dedicated comparator. Additionally, the output stage is not designed to drive low-impedance loads, so an external buffer or driver may be required.
  • The input impedance of the MCP6143 is typically around 10^12 ohms in common-mode and 10^9 ohms in differential-mode. However, this can vary depending on the specific application and operating conditions.

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MCP6143-I/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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