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MCP616-I/P - Microchip

Description: Microchip MCP616-I/P Op Amp, 0.19MHz CMOS, Rail to Rail, 3 V, 5 V, 8-Pin PDIP

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MCP616-I/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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MCP616-I/P - Microchip  - 3D model - Dual-In-Line Packages - 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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MCP616-I/P Details

  • Manufacturer Part Number:

    MCP616-I/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDIP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.46 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4.32 mm

  • Slew Rate-Nom:

    0.08 V/us

  • Supply Current-Max:

    0.025 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    190

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    7.62 mm

MCP616-I/P Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP616-I/P is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability, it's essential to follow proper compensation techniques, such as adding a capacitor in parallel with the feedback resistor to reduce the gain-bandwidth product. Additionally, ensure that the feedback loop has a sufficient phase margin (>45°) to prevent oscillations.
  • For optimal performance, use a star-grounding technique, where the op-amp's ground pin is connected to a central ground point. Keep the input and output traces short and separate to minimize noise coupling. Use a ground plane to reduce electromagnetic interference (EMI).
  • While the MCP616-I/P can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (0.5 V/μs) and limited bandwidth (2 MHz). A dedicated comparator like the MCP654 or MCP655 would be a better option for high-speed comparator applications.
  • To protect the MCP616-I/P from electrostatic discharge (ESD), use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Ensure that the PCB layout and handling procedures minimize the risk of ESD damage.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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