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MCP618-I/P - Microchip

Description: Microchip MCP618-I/P Op Amp, 190kHz Rail-Rail, 2.3 → 5.5 V, 8-Pin PDIP

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MCP618-I/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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MCP618-I/P - Microchip  - 3D model - Dual-In-Line Packages - 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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MCP618-I/P Details

  • Manufacturer Part Number:

    MCP618-I/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, PLASTIC, MS-001, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDIP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.46 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4.32 mm

  • Slew Rate-Nom:

    0.08 V/us

  • Supply Current-Max:

    0.025 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    190

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    7.62 mm

MCP618-I/P Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding topology, keeping analog and digital grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • The MCP618-I/P is rated for operation from -40°C to +125°C. Ensure proper thermal management by providing adequate heat sinking, airflow, and avoiding high-power dissipation nearby. Monitor the device's junction temperature (TJ) to prevent overheating.
  • Power up the VDD pin first, followed by the VREF pin, and then the input signals. Ensure that the input signals are within the specified voltage range before applying power to the VDD pin.
  • Follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. Ensure that the device is stored in an anti-static bag or tube during transportation and storage. Use ESD-sensitive devices handlers and avoid touching the device's pins during assembly.
  • Use a soldering iron with a temperature-controlled tip, and follow the recommended soldering profile (e.g., 260°C peak temperature, 10-15 seconds dwell time). Avoid applying excessive force or pressure during soldering, and ensure the device is properly aligned with the PCB pads.

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MCP618-I/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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