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MCP619-I/P - Microchip

Description: Operational Amplifiers - Op Amps Quad 2.3V PNP

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MCP619-I/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
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MCP619-I/P - Microchip  - 3D model - Dual-In-Line Packages - 14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
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MCP619-I/P Details

  • Manufacturer Part Number:

    MCP619-I/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8

  • Pin Count:

    14

  • Manufacturer Package Code:

    PDIP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.46 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4.32 mm

  • Slew Rate-Nom:

    0.08 V/us

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    190

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    7.62 mm

MCP619-I/P Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding topology, keeping the analog and digital grounds separate, and placing the device close to the power source. Additionally, using a solid ground plane and minimizing trace lengths can help reduce noise and EMI.
  • The MCP619-I/P is rated for operation from -40°C to +125°C. Ensure that the device is properly heatsinked, and that the ambient temperature is within the specified range. Also, consider using thermal management techniques such as thermal vias and thermal pads to dissipate heat.
  • Microchip recommends powering up the VDD pin first, followed by the VREF pin, and then the analog input signals. This sequence helps to ensure that the device powers up correctly and minimizes the risk of latch-up or damage.
  • The MCP619-I/P has a rail-to-rail output stage, but the output voltage swing may not reach the full supply voltage. To ensure proper operation, consider using an output buffer or amplifier to boost the output voltage swing, especially when driving heavy loads.
  • Microchip recommends using a low-pass filter with a cutoff frequency of around 100 kHz to 1 MHz to filter out high-frequency noise and oscillations. A simple RC filter or a more complex active filter can be used, depending on the specific application requirements.

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MCP619-I/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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