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MCP621ST-E/OT - Microchip

Description: Microchip MCP621ST-E/OT Op Amp, 20MHz Rail-Rail, 2.5 → 5.5 V, 5-Pin SOT-23

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PCB Footprints
MCP621ST-E/OT - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - OT
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3D Models
MCP621ST-E/OT - Microchip  - 3D model - SOT23 (5-Pin) - OT
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MCP621ST-E/OT Details

  • Manufacturer Part Number:

    MCP621ST-E/OT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23,5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    68 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    200 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    10 V/us

  • Supply Current-Max:

    3.6 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    20000

  • Voltage Gain-Min:

    50118

  • Wideband:

    NO

  • Width:

    1.55 mm

MCP621ST-E/OT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP621ST-E/OT is 360 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, ensure that the gain and phase margins are sufficient to prevent oscillations.
  • The recommended operating voltage range for the MCP621ST-E/OT is 2.5V to 5.5V, although the device can operate down to 1.8V with reduced performance. Operating outside this range may affect the device's reliability and performance.
  • The MCP621ST-E/OT is rated for operation up to 125°C, but the device's performance may degrade at higher temperatures. Ensure that the device is properly heat-sinked and follow the recommended thermal management guidelines to maintain reliability.
  • Follow proper ESD handling procedures when working with the MCP621ST-E/OT, such as using an ESD wrist strap, mat, or workstation. The device has built-in ESD protection, but it's still important to handle the device with care to prevent damage.

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MCP621ST-E/OT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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