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MCP624-E/ST - Microchip

Description: MCP624-E/ST Microchip,, Op Amp, 20MHz, 2.5 → 5.5 V, 14-Pin TSSOP

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PCB Footprints
MCP624-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - ST14 [TSSOP]
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3D Models
MCP624-E/ST - Microchip  - 3D model - Small Outline Packages - ST14 [TSSOP]
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MCP624-E/ST Details

  • Manufacturer Part Number:

    MCP624-E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    68 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    200 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    10 V/us

  • Supply Current-Max:

    14.4 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    20000

  • Voltage Gain-Min:

    25110

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP624-E/ST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP624-E/ST is 670 mW, which is calculated based on the maximum junction temperature (150°C) and the thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-100 pF) between the output and the inverting input pins to compensate for the op-amp's internal capacitance and prevent oscillations.
  • To minimize noise and EMI, it's recommended to follow good PCB layout practices, such as keeping the input and output traces separate, using a ground plane, and placing decoupling capacitors close to the op-amp's power pins. Additionally, avoid routing high-frequency signals near the op-amp's inputs and outputs.
  • While the MCP624-E/ST can be used as a comparator, it's not recommended due to its relatively slow slew rate (0.5 V/μs) and limited output current (20 mA). A dedicated comparator IC would be a better choice for most applications.
  • The MCP624-E/ST has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device, such as using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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