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MCP6241-E/MS - Microchip

Description: Single 1.8V 550KHz OpAmp,MCP6241-E/MS

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MCP6241-E/MS - Microchip - PCB symbol
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MCP6241-E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead MS MSOP
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MCP6241-E/MS - Microchip - 3D model - Small Outline Packages - 8 Lead MS MSOP
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MCP6241-E/MS Details

  • Manufacturer Part Number:

    MCP6241-E/MS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    PLASTIC, MS-187, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.3 V/us

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    550

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    3 mm

MCP6241-E/MS Frequently Asked Questions (FAQs)

  • Microchip recommends following good analog layout practices, such as separating analog and digital grounds, using a star-ground configuration, and placing the op-amp close to the signal source. Additionally, ensure that the input and output pins are not routed near each other to minimize crosstalk.
  • Microchip recommends powering up the VDD pin before the VSS pin, and powering down the VSS pin before the VDD pin. This ensures that the internal ESD protection diodes are not forward-biased, which can cause latch-up or damage.
  • The MCP6241-E/MS can drive capacitive loads up to 1nF without oscillation or instability. However, it's recommended to add a series resistor (Rs) to the output to ensure stability. The value of Rs depends on the capacitive load and the desired frequency response.
  • The MCP6241-E/MS has a limited common-mode voltage range, and exceeding it can cause the op-amp to latch up or behave erratically. If the input common-mode voltage exceeds the supply rails, it's recommended to add input protection circuitry, such as clamping diodes or resistors, to prevent damage or latch-up.
  • The thermal resistance of the MCP6241-E/MS package is typically around 150°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 150°C above the ambient temperature. It's essential to ensure proper heat sinking and thermal management to prevent overheating and ensure reliable operation.

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MCP6241-E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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