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MCP6271-E/P - Microchip

Description: Microchip MCP6271-E/P Op Amp, 2MHz Rail-Rail, 8-Pin PDIP

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MCP6271-E/P - Microchip - PCB symbol
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PCB Footprints
MCP6271-E/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8 pdip
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MCP6271-E/P - Microchip - 3D model - Dual-In-Line Packages - 8 pdip
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MCP6271-E/P Details

  • Manufacturer Part Number:

    MCP6271-E/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDIP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.27 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.334 mm

  • Slew Rate-Nom:

    0.9 V/us

  • Supply Current-Max:

    0.24 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    7.62 mm

MCP6271-E/P Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6271-E/P is dependent on the package type and ambient temperature. For the PDIP package, it is 670 mW at 25°C, while for the QFN package, it is 450 mW at 25°C. Refer to the thermal resistance and power dissipation sections in the datasheet for more information.
  • To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10-100 nF) between the output and the inverting input pins. This helps to compensate for the internal pole and ensures stability. Additionally, make sure to follow proper PCB layout and decoupling practices.
  • The recommended input common-mode voltage range for the MCP6271-E/P is between VDD - 1.2V and VSS + 0.2V. Operating outside this range may affect the op-amp's performance and accuracy.
  • While the MCP6271-E/P can be used as a comparator, it is not recommended due to its relatively slow slew rate (0.5 V/μs) and limited output current drive capability. Microchip offers dedicated comparator products, such as the MCP6541, which are better suited for comparator applications.
  • The MCP6271-E/P has built-in ESD protection, but it is still recommended to follow proper ESD handling and protection practices during device handling, PCB assembly, and system design. This includes using ESD-safe equipment, wrist straps, and mats, as well as incorporating ESD protection devices in the system design.

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MCP6271-E/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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