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MCP6274-E/ST - Microchip

Description: Quad 2MHz OpAmp,MCP6274-E/ST

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PCB Footprints
MCP6274-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (ST)14-Lead(TSSOP)
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3D Models
MCP6274-E/ST - Microchip  - 3D model - Small Outline Packages - (ST)14-Lead(TSSOP)
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MCP6274-E/ST Details

  • Manufacturer Part Number:

    MCP6274-E/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    0.9 V/us

  • Supply Current-Max:

    0.96 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP6274-E/ST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6274-E/ST is dependent on the package type and thermal resistance. For the SOIC package, the maximum power dissipation is approximately 720mW at 25°C ambient temperature.
  • To ensure stability in high-gain configurations, it's essential to follow proper PCB layout practices, use adequate decoupling capacitors, and consider adding a compensation capacitor between the output and the inverting input pins.
  • The recommended input impedance for the MCP6274-E/ST is greater than 1kΩ to ensure optimal performance and minimize input bias current effects.
  • While the MCP6274-E/ST can be used as a comparator, it's not recommended due to its op-amp architecture and limited output current capability. Microchip offers dedicated comparator products, such as the MCP6541, which are better suited for comparator applications.
  • To handle ESD protection, it's recommended to follow proper PCB design practices, use ESD protection devices such as TVS diodes or ESD arrays, and ensure that the device is handled and stored in an ESD-safe environment.

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MCP6274-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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