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MCP634-E/ST - Microchip

Description: Operational Amplifiers - Op Amps Quad 24MHz OP E temp

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MCP634-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (ST)14-Lead(TSSOP)
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MCP634-E/ST - Microchip  - 3D model - Small Outline Packages - (ST)14-Lead(TSSOP)
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MCP634-E/ST Details

  • Manufacturer Part Number:

    MCP634-E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM, PLASTIC, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    81 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    10 V/us

  • Supply Current-Max:

    14.4 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    24000

  • Voltage Gain-Min:

    25100

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP634-E/ST Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding layout, keeping the op-amp close to the signal source, and using a ground plane to minimize noise. Additionally, place decoupling capacitors close to the power pins and use a low-ESR capacitor for the bypass capacitor.
  • To minimize the effects of input bias current, use a high-impedance source or add a voltage follower stage. For input offset voltage, use a trimmer pot or a voltage reference to adjust the output voltage to the desired level.
  • The MCP634-E/ST can drive a maximum capacitive load of 100 pF. Exceeding this limit may cause oscillations or instability. Use a series resistor to limit the capacitive load if necessary.
  • To ensure stability, use a compensation capacitor (e.g., 10-100 pF) between the output and the inverting input. Additionally, use a low-ESR capacitor for the bypass capacitor and avoid using long wires or traces in the feedback loop.
  • Use a 10-100 nF ceramic capacitor in parallel with a 1-10 μF electrolytic capacitor for power supply decoupling. Place the capacitors close to the power pins and use a low-ESR capacitor for the electrolytic capacitor.

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MCP634-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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