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MCP6442T-E/MNY - Microchip

Description: MCP6442T-E/MNY, Operational Amplifier Linear 9kHz R-R, 1.4 to 6V, 8-Pin TDFN

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PCB Footprints
MCP6442T-E/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - (MN) [TDFN]
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3D Models
MCP6442T-E/MNY - Microchip  - 3D model - Small Outline No-lead - (MN) [TDFN]
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MCP6442T-E/MNY Details

  • Manufacturer Part Number:

    MCP6442T-E/MNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    3000 V/us

  • Supply Current-Max:

    0.0013 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    9

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    2 mm

MCP6442T-E/MNY Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6442T-E/MNY is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100 pF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • To minimize noise and EMI, it's recommended to follow good PCB layout practices, such as keeping the input and output traces separate, using a ground plane, and placing decoupling capacitors close to the op-amp's power pins.
  • Yes, the MCP6442T-E/MNY can be used as a comparator, but it's essential to ensure that the input common-mode voltage is within the specified range, and to add hysteresis to prevent oscillations. Additionally, the output stage may require additional buffering to drive external loads.
  • To handle the input bias current and offset voltage, it's recommended to use a high-impedance input source, add a bias current compensation network, and consider using a chopper-stabilized or auto-zero op-amp if the application requires high precision.

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MCP6442T-E/MNY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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