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MCP6471T-E/LTY - Microchip

Description: Operational Amplifiers - Op Amps Single 2 MHz OP E temp

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MCP6471T-E/LTY - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Lead Plastic Small Outine Transistor (LTY) [SC70]
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3D Models
MCP6471T-E/LTY - Microchip  - 3D model - SOT23 (5-Pin) - 5-Lead Plastic Small Outine Transistor (LTY) [SC70]
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MCP6471T-E/LTY Details

  • Manufacturer Part Number:

    MCP6471T-E/LTY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, SC-70, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SC70-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00035 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    88 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.1 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    1.25 mm

MCP6471T-E/LTY Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding layout, keeping the op-amp close to the signal source, and using a ground plane to minimize noise. Additionally, place decoupling capacitors close to the power pins and use a low-ESR capacitor for the bypass capacitor.
  • The recommended value for Cbyp is 0.1 μF to 1 μF, with a low-ESR ceramic capacitor being a good choice. The value should be chosen based on the specific application's noise requirements and the op-amp's power supply rejection ratio (PSRR).
  • The MCP6471T-E/LTY can drive a maximum capacitive load of 1 nF to 10 nF, depending on the specific application and the op-amp's output impedance. Exceeding this limit may cause oscillations or instability.
  • To ensure stability, follow the recommended layout and placement guidelines, use a low-ESR bypass capacitor, and avoid using long traces or wires that can introduce parasitic inductance. Additionally, consider adding a small resistor (e.g., 10 Ω to 100 Ω) in series with the output to dampen oscillations.
  • The MCP6471T-E/LTY has an operating temperature range of -40°C to +125°C, making it suitable for a wide range of industrial and automotive applications.

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MCP6471T-E/LTY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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