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MCP6472-E/SN - Microchip

Description: Microchip MCP6472-E/SN Low Power Op Amp, 2MHz Rail-Rail, 2 → 5.5 V, 8-Pin SOIC

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MCP6472-E/SN - Microchip - PCB symbol
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MCP6472-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - SST26VF016BT-104I/SN
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MCP6472-E/SN Details

  • Manufacturer Part Number:

    MCP6472-E/SN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3.90 MM, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00035 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    88 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1.1 V/us

  • Supply Current-Max:

    0.4 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6472-E/SN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6472-E/SN is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 720mW at 25°C. For the MSOP package, it is 560mW at 25°C. Refer to the thermal resistance and power dissipation sections in the datasheet for more information.
  • To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10nF to 100nF) between the output and the inverting input pins. This capacitor helps to compensate for the internal pole of the op-amp and prevents oscillations.
  • To minimize noise and EMI, it is recommended to follow good PCB layout and routing practices, such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the op-amp. Additionally, it is recommended to use a low-impedance power supply and to avoid running high-frequency signals near the op-amp.
  • The MCP6472-E/SN is rated for operation up to 125°C, but the performance may degrade at high temperatures. It is recommended to consult the datasheet and application notes for more information on high-temperature operation and to consider using a more temperature-stable op-amp if necessary.
  • The input bias current of the MCP6472-E/SN is typically specified as a maximum value in the datasheet. To calculate the input bias current, you can use the formula: IB = (VCC - VEE) / (2 * RIN), where IB is the input bias current, VCC is the positive supply voltage, VEE is the negative supply voltage, and RIN is the input resistance.

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MCP6472-E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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