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MCP6479T-E/SL - Microchip

Description: Low Quiescent Current: - 170 µA (maximum)/amplifier • Low Input Offset Voltage: - ±1.6 mV (maximum) • Enhanced EMI Protection: - Electromagnetic Interference Rejection Ratio (EMIRR) at 1.8 GHz: 90 dB • Supply Voltage Range: 1.8V to 5.5V • Gain Bandwidth Product: 3 MHz (typical) • Rail-to-Rail Input/Output • Unity Gain Stable • No Phase Reversal • Quick Start-up Time: 6 µs (typical) • Small Packages • Extended Temperature Range: -40°C to +125°C • AEC Q100 Qualified, Grade 1

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MCP6479T-E/SL - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]-
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MCP6479T-E/SL - Microchip  - 3D model - Small Outline Packages - 14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]-
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MCP6479T-E/SL Details

  • Manufacturer Part Number:

    MCP6479T-E/SL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOIC-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    0.0016 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    3.2 V/us

  • Supply Current-Max:

    0.17 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    177827.941

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6479T-E/SL Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6479T-E/SL is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-100 nF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • To minimize noise and EMI, it's recommended to follow good PCB layout practices, such as keeping the input and output traces short and separate, using a solid ground plane, and avoiding routing signals near the op-amp's power pins.
  • The MCP6479T-E/SL is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's power dissipation and ensure proper thermal management to prevent overheating.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to handle the MCP6479T-E/SL with an ESD wrist strap or mat, and to ensure that the device is properly grounded during assembly and testing.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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