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MCP6494-E/ST - Microchip

Description: Microchip MCP6494-E/ST Low Power Op Amp, 7.5MHz Rail-Rail, 2.4 → 5.5 V, 14-Pin TSSOP

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PCB Footprints
MCP6494-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - **14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
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3D Models
MCP6494-E/ST - Microchip  - 3D model - Small Outline Packages - **14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
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MCP6494-E/ST Details

  • Manufacturer Part Number:

    MCP6494-E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00035 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    88 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    6 V/us

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    7500

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP6494-E/ST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6494-E/ST is dependent on the package type and thermal resistance. For the SOIC package, the maximum power dissipation is approximately 720mW at 25°C ambient temperature.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-100pF) between the output and the inverting input to compensate for the internal pole. Additionally, ensure that the layout is well-designed to minimize parasitic capacitance and inductance.
  • The recommended input common-mode voltage range for the MCP6494-E/ST is between VDD-1.5V and VSS+1.5V. Operating outside this range may affect the op-amp's performance and stability.
  • While the MCP6494-E/ST can be used as a comparator, it's not recommended due to its relatively slow slew rate (0.5V/μs) and limited output current drive capability. A dedicated comparator IC would be a better choice for most applications.
  • The MCP6494-E/ST has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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MCP6494-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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