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MCP6H01T-E/OT - Microchip

Description: MICROCHIP - MCP6H01T-E/OT - OP-AMP, 1.2MHZ, 0.8V/US, SOT-23-5

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PCB Footprints
MCP6H01T-E/OT - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Lead (OT) SOT-23
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MCP6H01T-E/OT - Microchip  - 3D model - SOT23 (5-Pin) - 5-Lead (OT) SOT-23
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MCP6H01T-E/OT Details

  • Manufacturer Part Number:

    MCP6H01T-E/OT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.025 µA

  • Common-mode Reject Ratio-Min:

    84 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.8 V/us

  • Supply Current-Max:

    0.185 mA

  • Supply Voltage Limit-Max:

    17 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    1.55 mm

MCP6H01T-E/OT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6H01T-E/OT is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, consider using a phase margin analyzer tool to verify stability.
  • For optimal performance, keep the input and output traces short and symmetrical, avoid crossing signal traces, and use a solid ground plane. Also, place decoupling capacitors close to the op-amp's power pins and use a low-ESR capacitor for the bypass capacitor.
  • The MCP6H01T-E/OT is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate in high-temperature environments, consider using a thermally enhanced package or a different op-amp with a higher temperature rating.
  • To prevent electrostatic discharge (ESD) damage, use ESD protection devices (e.g., TVS diodes) on the input and output pins, and follow proper handling and storage procedures to minimize ESD exposure.

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MCP6H01T-E/OT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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