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MCP6H02T-E/MNY - Microchip

Description: Microchip MCP6H02T-E/MNY, Dual Op Amp, 1.2MHz Rail-Rail, 3.5 → 16 V, 8-Pin TDFN

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MCP6H02T-E/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead Plastic DFN (MN) 2x3x0.75mm
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MCP6H02T-E/MNY - Microchip  - 3D model - Small Outline No-lead - 8-Lead Plastic DFN (MN) 2x3x0.75mm
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MCP6H02T-E/MNY Details

  • Manufacturer Part Number:

    MCP6H02T-E/MNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.025 µA

  • Common-mode Reject Ratio-Min:

    84 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    0.8 V/us

  • Supply Current-Max:

    0.37 mA

  • Supply Voltage Limit-Max:

    17 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    2 mm

MCP6H02T-E/MNY Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6H02T-E/MNY is 670mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, consider using a phase margin analyzer tool to verify stability.
  • The recommended input impedance for the MCP6H02T-E/MNY is greater than 1kΩ to ensure optimal performance and minimize input bias current effects.
  • While the MCP6H02T-E/MNY can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (2.5V/μs) and limited output current (±20mA). A dedicated comparator IC would be a better option for most applications.
  • To ensure ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and consider adding external ESD protection devices (e.g., TVS diodes) to your design.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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