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MCP6L02T-E/SN - Microchip

Description: Dual 1.8V, 1MHz OP Amp, E temp

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MCP6L02T-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - SN
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MCP6L02T-E/SN - Microchip  - 3D model - Small Outline Packages - SN
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MCP6L02T-E/SN Details

  • Manufacturer Part Number:

    MCP6L02T-E/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, LEAD FREE, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    78 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    0.34 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1000

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6L02T-E/SN Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP6L02T-E/SN involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the input filter capacitors. Additionally, it's recommended to use a low-ESR capacitor for the bypass capacitor (C2) and to keep the power traces as short as possible.
  • The input capacitor (C1) should be a low-ESR ceramic capacitor with a value between 1uF to 10uF, depending on the input voltage and frequency. The output capacitor (C2) should be a low-ESR ceramic capacitor with a value between 1uF to 22uF, depending on the output voltage and frequency. It's also important to consider the capacitor's voltage rating, temperature range, and ESR.
  • The maximum input voltage for the MCP6L02T-E/SN is 42V, but it's recommended to operate the device within the specified input voltage range of 2.7V to 36V to ensure optimal performance and reliability.
  • To ensure the stability of the output voltage, it's recommended to use a minimum output capacitance of 1uF, keep the output traces as short as possible, and avoid using long output cables. Additionally, the output voltage can be stabilized by adding a small ceramic capacitor (e.g., 100nF) in parallel with the output capacitor (C2).
  • The thermal resistance of the MCP6L02T-E/SN package is 125°C/W (junction-to-ambient) and 45°C/W (junction-to-case). It's recommended to use a thermal pad or a heat sink to improve the thermal performance of the device.

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MCP6L02T-E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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