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MCP6V02-E/MD - Microchip

Description: Microchip MCP6V02-E/MD, Dual Auto Zero Op Amp, 1.3MHz Rail-Rail, 1.8 → 5.5 V, 8-Pin DFN

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PCB Footprints
MCP6V02-E/MD - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
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3D Models
MCP6V02-E/MD - Microchip  - 3D model - Small Outline No-lead - 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
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MCP6V02-E/MD Details

  • Manufacturer Part Number:

    MCP6V02-E/MD

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    4 X 4 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    DFN-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Nom:

    142 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.15,32

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    1300

  • Voltage Gain-Min:

    3162000

  • Wideband:

    NO

  • Width:

    4 mm

MCP6V02-E/MD Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP6V02-E/MD involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a low-ESR capacitor for the input bypass capacitor and to keep the output capacitor close to the output pin.
  • To ensure the stability of the output voltage, it's essential to choose the correct output capacitor value and type. A minimum capacitance of 1uF is recommended, and the capacitor should have a low ESR. Additionally, the output capacitor should be placed close to the output pin, and the input capacitor should be placed close to the input pin.
  • The maximum input voltage that the MCP6V02-E/MD can handle is 42V. Exceeding this voltage can cause damage to the device.
  • The MCP6V02-E/MD is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal design and heat dissipation in the system to ensure reliable operation.
  • The power dissipation of the MCP6V02-E/MD can be calculated using the formula: Pd = (Vin - Vout) x Iout. Where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.

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MCP6V02-E/MD Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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