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MCP6V66T-E/OT - Microchip

Description: Features • High DC Precision: - VOS Drift: ±150 nV/°C (maximum) - VOS: ±25 µV (maximum) - AOL: 110 dB (minimum, VDD = 5.5V) - PSRR: 110 dB (minimum, VDD = 5.5V) - CMRR: 111 dB (minimum, VDD = 5.5V) - Eni: 0.54 µVP-P (typical), f = 0.1 Hz to 10 Hz - Eni: 0.17 µVP-P (typical), f = 0.01 Hz to 1 Hz • Enhanced EMI Protection: - Electromagnetic Interference Rejection Ratio (EMIRR) at 1.8 GHz: 101 dB • Low Power and Supply Voltages: - IQ: 80 µA/amplifier (typical) - Wide Supply Voltage Range: 1.8V to

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PCB Footprints
MCP6V66T-E/OT - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5 Lead Plastic Smal Outline Transistor (OT) (sot23)
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MCP6V66T-E/OT - Microchip  - 3D model - SOT23 (5-Pin) - 5 Lead Plastic Smal Outline Transistor (OT) (sot23)
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MCP6V66T-E/OT Details

  • Manufacturer Part Number:

    MCP6V66T-E/OT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2019-10-21

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    111 dB

  • Common-mode Reject Ratio-Nom:

    134 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.45 V/us

  • Supply Current-Max:

    0.13 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    316227

  • Wideband:

    NO

  • Width:

    1.6 mm

MCP6V66T-E/OT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6V66T-E/OT is 1250 mW (milliwatts) at a junction temperature of 150°C.
  • The output voltage of the MCP6V66T-E/OT can be calculated using the formula: Vout = (R1/R2) * (Vref - Voffset), where R1 and R2 are the resistors connected to the output pin, Vref is the reference voltage (2.5V), and Voffset is the offset voltage (typically 0.5mV).
  • The typical current consumption of the MCP6V66T-E/OT is 1.2 mA (milliamperes) when operating from a 5V supply voltage.
  • No, the MCP6V66T-E/OT is a voltage reference, not a voltage regulator. It is designed to provide a stable reference voltage, but it does not have the capability to regulate an output voltage.
  • The MCP6V66T-E/OT has an operating temperature range of -40°C to +125°C, and a storage temperature range of -65°C to +150°C.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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