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MCP6V89T-E/ST - Microchip

Description: Precision Amplifiers Quad, Zero-Drift Op Amp, E Temp

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MCP6V89T-E/ST - Microchip - PCB symbol
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MCP6V89T-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - .14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
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MCP6V89T-E/ST - Microchip - 3D model - Small Outline Packages - .14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
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MCP6V89T-E/ST Details

  • Manufacturer Part Number:

    MCP6V89T-E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    112 dB

  • Common-mode Reject Ratio-Nom:

    136 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    4 V/us

  • Supply Current-Max:

    3.08 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    5000

  • Voltage Gain-Min:

    70794

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP6V89T-E/ST Frequently Asked Questions (FAQs)

  • Microchip recommends a star-ground configuration, with the device's GND pin connected to a central ground point, and the use of separate analog and digital ground planes to minimize noise coupling. Additionally, keep the input and output traces as short as possible and avoid running them parallel to each other.
  • To ensure stability, make sure to decouple the device's power supply pins (VDD and VSS) with a 10uF capacitor, and use a 1uF capacitor in parallel with a 10Ω resistor between the output pin and the feedback pin. Additionally, ensure that the input and output impedance are matched, and the gain is set within the recommended range.
  • The MCP6V89T-E/ST can drive a maximum capacitive load of 100pF. Exceeding this limit may cause oscillations or instability in the device.
  • The MCP6V89T-E/ST is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. Ensure that the device is operated within its recommended temperature range and that proper thermal management is implemented to prevent overheating.
  • To troubleshoot oscillations or instability issues, check the PCB layout for noise coupling, ensure that the power supply is clean and well-regulated, and verify that the input and output impedance are matched. Also, check the gain setting and ensure that it is within the recommended range. If the issue persists, consult the Microchip application note AN-1142 for further troubleshooting guidance.

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MCP6V89T-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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