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MCP6V96T-E/OT - Microchip

Description: Operational Amplifiers - Op Amps Single, Zero-Drift Op Amp, E Temp

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PCB Footprints
MCP6V96T-E/OT - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - (OT) [SOT23]
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3D Models
MCP6V96T-E/OT - Microchip  - 3D model - SOT23 (5-Pin) - (OT) [SOT23]
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MCP6V96T-E/OT Details

  • Manufacturer Part Number:

    MCP6V96T-E/OT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    112 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    9.5 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10

  • Voltage Gain-Min:

    70794.578

  • Wideband:

    NO

  • Width:

    1.6 mm

MCP6V96T-E/OT Frequently Asked Questions (FAQs)

  • Microchip recommends a star-ground configuration, with the VIN and VOUT pins placed close to the device, and the GND pin connected to a solid ground plane. Additionally, keep the input and output traces separate and away from the noise-sensitive analog signals.
  • To ensure stability, use a minimum output capacitance of 10uF, and a maximum ESR of 1 ohm. Also, ensure that the output voltage is within the recommended range of 0.8V to 5.5V, and the input voltage is within the recommended range of 2.2V to 6.0V.
  • The MCP6V96T-E/OT can deliver up to 150mA of output current. However, it's recommended to derate the current based on the ambient temperature and the input voltage to ensure reliable operation.
  • Use external voltage protection devices such as TVS diodes or voltage supervisors to protect the MCP6V96T-E/OT from overvoltage and undervoltage conditions. Additionally, ensure that the input voltage is within the recommended range of 2.2V to 6.0V.
  • The thermal shutdown temperature of the MCP6V96T-E/OT is typically around 150°C. When the device temperature exceeds this threshold, it will shut down to prevent damage.

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MCP6V96T-E/OT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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