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MCPRW02WKP101B00 - Multicomp Pro

Description: MULTICOMP - MCPRW02WKP101B00 - RESISTOR, CEMENT, 100 OHM, 2W, 10%

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MCPRW02WKP101B00 - Multicomp Pro - PCB symbol
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PCB Footprints
MCPRW02WKP101B00 - Multicomp Pro PCB footprint - Other - Other - MCPRW02WKP101B00-2
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MCPRW02WKP101B00 Details

  • Manufacturer Part Number:

    MCPRW02WKP101B00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.90

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    6.25

  • Construction:

    Axial

  • Lead Diameter:

    0.75 mm

  • Lead Length:

    28 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    7 mm

  • Package Length:

    18 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    Axial

  • Package Width:

    7 mm

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Resistance:

    100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Surface Mount:

    NO

  • Technology:

    METAL OXIDE FILM

  • Temperature Coefficient:

    350 ppm/°C

  • Terminal Shape:

    WIRE

  • Tolerance:

    10%

  • Working Voltage:

    500 V

MCPRW02WKP101B00 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the SPC Multicomp's application note or by contacting their technical support. A general guideline is to follow the JEDEC standard for QFN packages.
  • The device has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Ensure good airflow and consider using a heat sink if the device is expected to operate at high temperatures.
  • The maximum operating temperature range is -40°C to 125°C, but the device's performance and reliability may degrade above 85°C. It's essential to ensure the device operates within the recommended temperature range for optimal performance.
  • Follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point below 260°C, and ensure the PCB is designed with a solder mask to prevent solder bridging. Inspect the solder joints for any defects or cold joints.
  • The device has built-in ESD protection, but it's still essential to handle the device with care. Use an ESD wrist strap or mat, and ensure the PCB is designed with ESD protection in mind. Avoid touching the device's pins or exposing it to static electricity.

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MCPRW02WKP101B00 Overview

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