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MCQ07P06Y-TP - MCC

Description: Power MOSFETS

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PCB Footprints
MCQ07P06Y-TP - MCC PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8(H=1.75mm)
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3D Models
MCQ07P06Y-TP - MCC  - 3D model - Small Outline Packages - SOP-8(H=1.75mm)
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MCQ07P06Y-TP Details

  • Manufacturer Part Number:

    MCQ07P06Y-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.06 Ω

MCQ07P06Y-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MCQ07P06Y-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • Yes, MCQ07P06Y-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated and that the application meets the recommended operating conditions.
  • To handle the ESD sensitivity of MCQ07P06Y-TP, it's recommended to follow proper ESD handling procedures, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging. Additionally, ensure that the device is properly grounded during handling and assembly.
  • The recommended soldering profile for MCQ07P06Y-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to ensure reliable assembly and prevent damage to the device.
  • Yes, MCQ07P06Y-TP is rated for operation in humid environments, with a moisture sensitivity level (MSL) of 1. However, it's essential to ensure that the device is properly sealed and protected from moisture ingress to prevent damage or corrosion.

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MCQ07P06Y-TP Overview

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