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MCQD08N03A-TP - MCC

Description: Mosfet Array 30V 8.5A 3W Surface Mount 8-SOP

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PCB Footprints
MCQD08N03A-TP - MCC PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8_2023
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3D Models
MCQD08N03A-TP - MCC  - 3D model - Small Outline Packages - SOP-8_2023
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MCQD08N03A-TP Details

  • Manufacturer Part Number:

    MCQD08N03A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    8.5 A

  • Drain-source On Resistance-Max:

    0.032 Ω

  • JESD-609 Code:

    e3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    10

MCQD08N03A-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MCQD08N03A-TP is a standard SOT-23 package with a 1.5mm x 1.5mm pad size and a 0.5mm x 0.5mm thermal pad.
  • Yes, MCQD08N03A-TP is rated for operation up to 150°C, but it's recommended to derate the power dissipation at higher temperatures to ensure reliability.
  • To ensure reliability in high-humidity environments, it's recommended to use a conformal coating, follow proper PCB design and assembly guidelines, and store the devices in a dry environment.
  • The recommended ESD protection for MCQD08N03A-TP is to follow the JEDEC standard JESD22-A114, which recommends a human body model (HBM) of 2kV and a machine model (MM) of 200V.
  • Yes, MCQD08N03A-TP is suitable for switching regulator applications due to its low RDS(on) and high current capability, but it's recommended to ensure the device is properly biased and the PCB is designed to minimize parasitic inductance.

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MCQD08N03A-TP Overview

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