ROHM recommends a compact PCB layout with short traces and minimal vias to reduce parasitic inductance and capacitance. A 4-layer PCB with a solid ground plane is recommended. Refer to ROHM's application notes for more details.
The MCR03EZPD2202 has a high power dissipation rating. Ensure good thermal conductivity by using a thermal pad or thermal interface material (TIM) between the device and a heat sink. A heat sink with a thermal resistance of 10°C/W or less is recommended.
The MCR03EZPD2202 has an operating temperature range of -40°C to 150°C. However, the device's performance and reliability may degrade at extreme temperatures. Consult ROHM's datasheet and application notes for more information.
Yes, the MCR03EZPD2202 is suitable for high-frequency switching applications up to 1 MHz. However, ensure that the PCB layout and component selection are optimized for high-frequency operation to minimize losses and ringing.
Use a voltage regulator or overvoltage protection (OVP) circuit to prevent voltage exceeding the maximum rating. Implement overcurrent protection (OCP) using a current sense resistor and a comparator or a dedicated OCP IC. Consult ROHM's application notes for more information.
Trust Checks
This model has been generated by a fully automated process.
Machine Generated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MCR03EZPD2202 Overview
Use the download button to access the MCR03EZPD2202 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MCR03,
or try a keyword search, such as Metal Glaze/Thick Film Resistors